As electronic product designs become more and more sophisticated and packaging difficulties increase, the improvement of SMT chip yields has become one of the key points in reducing the cost of hardware manufacturing. BGA, IC, etc. in PCBA are the key devices. The success rate of these devices during soldering is the key point. PCB manufacturing has become heavy.

The size of the BGA ball in the picture above is the same as viewed under a 50x magnifier. At the same amount of tin, the size of the ball can be consistent, so as to ensure the soldering of the entire BGA.