Rigid-flex
Description	Capabilities
1．Product Range	2-10L（HDI：1+N+1；2+N+2）
2．Board thickness	0.2mm-3.0mm
3．Copper Foil	Inner: 3oz, Outer: 4oz
4．Board thickness’ tolerance	+/-10%—–+/-8%
5．Material	FR4+PI
6．Surface treatment	HASL, HASL Lead free, OSP, Plating gold(1u”-50u”) ENIG(1u”-8u”) Gold Finger(1u”-50u”) Immersion silver,  Immersion Tin(0.8-1.5um)
7．Size of finished product	Min: 10*10mm, Max: 1200*500mm
8．Min. mechanical via holes & pad	Holes: 0.2mm/pad: 0.4mm
9．Min Laser drilling holes & pad	0.1mm, pad<0.1mm
10．Min. hole tolerance	+/-0.05mm(NPTH), +/-0.075mm(PTH)
11．Min copper thickness of holes’wall	20um
12．Min space of drilling holes to conductor	0.15mm(<8L);0.2(8<14);0.225mm(<=24L)
13．Min. conductor width/space	0.075/0.075mm(3/3mil)
14．Min size of solder PAD/Annulus	Pad:0.4mm/0.3mm(laser drilling),  Min.annual ring:0.1mm
15．Hole wall to conductor Innerlayers of multilayer	0.2mm
16．Hole to hole edge gap	0.8mm
17．Solder mask color & Thickness	Color: Green, Black, Yellow, Blue, Red, White, Matt green Thickness: 10-20um
18．Silk-screen color	White, Black, Yellow
19．Profile tolerance	+/-0.15mm(Routing), +/-0.1mm(Punching)
20. Min space from conductor/holes to edge	0.15mm/0.2mm
21．Warp & twist	0.3%-0.7%
22．Thickness of peelablemask	0.2-0.5mm (Max plugging holes: 4.5mm)
23．Bevel angle of gold finger	20，30，45，60(Tolerance: +/-5 degree)
24．Impedance tolerance	+/-5ohm
25．V-CUT board thickness	0.6-3.0mm
26． Max multi-press	<=3
27．Min tolerance of milling slot	+/-0.15mm
28．Ratio of board thickness/holes size	12:1